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SoFix S-BGN2 Mini BGA Heating Station for MacBook / Laptop / Tablet Motherboard Soldering Repair New Arrival
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Introducing the SoFix S-BGN2 MiNi BGA Heating Station, a state-of-the-art tool designed for precision motherboard repairs and upgrades. This versatile station is equipped to handle a variety of tasks, including replacing the CPU, graphics card, PCH, upgrading memory and SSDs, and removing the T2 chip. With its advanced soldering and heating capabilities, the S-BGN2 ensures that your motherboard maintenance is efficient and effective.
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Product usage
- S-BGN2 is used to fix the motherboard and provide a heating function for the motherboard
- It can be used for replacement of large and small CPUs, graphics cards, PCHs, memory/SSDs, and removing the T2 chip.
- Supports BGA chip disassembly and assembly of MacBook, iPad logic board, Windows notebooks, tablets, etc.
- Auxiliary heating/Removal of high-temperature solder, Replacement of BGA processors, Fixing motherboard/Convenient removal of black glue from BGA chip
Platform Working Modes
1. Baking Board
- Baking motherboard
- Auxiliary heating for cleaning high-temperature solder from pads
- Remove RAM/T2 chips
- General high-temperature applications
2. CPU/PCH
- Welding large processors (e.g., Intel CPUs, M1 Pro/Max, M2 Pro/Max)
- Welding GPUs (graphics card chips).
3. Small CPU/PCH
- Welding small processors (e.g., A1932/A2179, M1/M2/M3)
- Welding Platform Controller Hubs (PCH)
4. Pause/Return
- Pause: Stops or starts the current process
- Return: Long press to return to the home page
Interface Functions:
- ON/OFF: Switch key (Controls the main power input on and off)
- AC~INPUT (110V-220V): AC power input, Supports 110V and 220V specifications
- 30:00: 30-minute power protection. The power is automatically cut off after 30 minutes of working. Heats for a long time
- RESET: The button resets the host's status. After pressing the “RESET” button, the host will return to the working state.
How to use
- Preheating: Indicates that the motherboard is preheating. When the progress bar reaches 50%, you can use tweezers to remove the white glue around the chip.
- Heating: Indicates that the heater is heating up.
- Soldering: When the heating progress bar reaches 100%, Preheating changes to Soldering, indicating that the motherboard has reached the soldering state.
- In the soldering state, a buzzer will sound. At this time, you can use an air gun to heat. After about one minute, remove the BGA chip
Specifications of SoFix S-BGN2
- Brand: SoFix
- Model: S-BGN2
- Product Name: Mini BGA Heating Station
- Main Use: Preheating/Desoldering
- Input Voltage: 110/220V
- Temperature Regulation: 0 to 400°C
- Scope of application: Preheated soldering of electronic products and PCB
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