Features:

• Stencil magnetic suction leveling, free hands; scraping tin does not move, more uniform, with the magnet base to use, planting tin is more simple and convenient, not easy drums

• Innovative slope design, so that the chip is more closely, compatible with thinner chip C, pads do not overhang more evenly

• Good compatibility, suitable for 0.9mm thickness chip, most of the current mobile phone chip auxiliary tin planting

• Strong expandability, applicable to more than 50mm size stencil, supports Amaoe single CPU mesh, integrated mesh, CPU integrated mesh, and so on.

• High-temperature resistance, good heat insulation effect, heat insulation pad with adhesion characteristics, non-slip and non-displacement

• Soft and not easy to deform, good elasticity, can be curled at will, not attenuated deformation for a long time

Package includes:

• According to your choice